Overview
Salary
8,000 SGD ~ 14,000 SGD
Industry
Manufacturing(Electronics/Semiconductors)
Job Description
Our client is launching a new business and establishing a new factory in Singapore. They are seeking an experienced Wet Etch Process Engineer to join their team and contribute to advanced packaging solutions.
【 Responsibilities 】
Process Development & Optimization
-Develop and optimize wet etching processes for substrate layers.
-Design experiments (DOE) to evaluate and improve critical etch parameters (e.g., etch rate, uniformity).
-Establish and maintain robust process windows for R&D and volume production.
Equipment & Materials Management
-Define equipment requirements and manage tool qualifications (e.g., acid/ultrasonic cleaning, wet benches).
-Monitor and maintain etching tool performance, chemistry concentration, and bath lifetime.
-Evaluate and select etchants, and chemistry blends suitable for advanced substrates.
Yield, Quality & Defect Control
-Identify and resolve etching-related defects such as over-etch, or residues.
-Analyze root causes of defects using SEM, optical inspection, and profilometry tools.
-Collaborate with upstream/downstream processes to improve overall line yield and substrate performance.
Cross-Functional Collaboration
-Work closely with plating, lithography, CMP, and lamination teams to ensure seamless process integration.
-Support new product introductions (NPI) and customer qualifications with process stability and repeatability.
Documentation & Compliance
-Create and maintain technical documentation such as process specifications, control plans, FMEAs, and work instructions.
-Ensure processes comply with environmental, safety, and chemical handling regulations.
Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.
Qualifications
Requirement
【Requirements & Preferences】
(Must)
-PhD or Master’s degree in Chemical Engineering, Materials Science, Microelectronics, or related field.
-5–10+ years of hands-on experience in substrate, PCB, or semiconductor etching processes.
-Familiar with substrate materials such as ABF, PID, PI, or photoresists.
-Knowledge of Damascene/SAP processes for high-density substrates.
-Proficiency with process characterization tools (SEM, AFM, XPS, optical profilers).
-Familiar with SPC, Six Sigma, and yield enhancement methodologies.
(Advantageous)
-Knowledge of substrate technologies such as Damascene, SAP, ABF build-up, or Embedding is a plus.English Level
-
Other Language
-
Additional Information
Benefit
【 What you will receive 】
- AWS
- Variable Bonus (based on company and individual performance)
- Annual Leave: 16 days (up to a maximum of 20 days)
- Medical Leave
- Family care leave (2 days/year)
- Dental care
- Company phone will be providedWorking Hour
8:00 ~ 17:00
Holiday
-
Job Function
Please sign in.