Overview

• Salary

  8,000 SGD ~ 14,000 SGD

• Industry

  Manufacturing(Electronics/Semiconductors)

• Job Description

  Our Client is seeking a skilled and motivated Simulation Engineer to join our R&D and Manufacturing teams. This role focuses on developing and utilizing computational models—particularly Computational Fluid Dynamics (CFD)—to simulate and optimize the slit coating process for organic dielectric materials. The ideal candidate will have a strong foundation in fluid dynamics, material science, and numerical methods to support improvements in process stability, uniformity, and overall efficiency.
  Reports to: R&D Manager
  
  【 Responsibilities 】
  - Develop and validate mathematical models and algorithms to simulate the physics of the slit coating process, including fluid flow, material properties (viscosity, surface tension, rheology), tool parameters (coating speed, coating gap, slot-die design), and thermal dynamics.
  - Utilize CFD software to analyse and screen a broad range of tool parameters and material variables to identify optimal die geometry, ideal material properties (e.g., target viscosity range), and a stable operating window without consuming excessive material or production time.
  - Design and execute simulation experiments to test hypotheses, identify critical process parameters (e.g., coating speed, flow rate, die gap, substrate speed), and validate model accuracy against experimental data.
  - Collaborate with cross-functional teams—including design engineers, material scientists, and manufacturing teams—to design focused DoE experiments guided by simulation insights, and validate optimized parameters in real-world conditions.
  - Analyse simulation results, interpret key findings, and provide actionable recommendations to improve coating quality, reduce defects, and enhance process efficiency.
  - Prepare comprehensive technical documentation, including simulation methodologies, assumptions, results, and recommendations, for internal and external stakeholders.
  - Stay updated with advancements in simulation software, numerical methods, thin-film deposition technologies, and modelling techniques relevant to semiconductor manufacturing.