Overview

• Salary

  4,500 SGD ~ 8,000 SGD

• Industry

  Manufacturing(Electronics/Semiconductors)

• Job Description

  Our client is launching a new business and establishing a new factory in Singapore. They are seeking a talented Plating Process Engineer to join their team and contribute to advanced substrate manufacturing.
  
  Reports to: R&D Manager
  
  【 Responsibilities 】
  1. Process Development
  - Develop and optimize plating processes (e.g., electrolytic copper, Ni/Sn).
  - Evaluate new chemicals, materials, and equipment for plating process enhancement.
  - Establish plating parameters to ensure uniform thickness, adhesion, and reliability.
  
  2. Process Control & Monitoring
  - Monitor plating bath chemistry and maintain proper control limits.
  - Implement Statistical Process Control (SPC) and DOE to analyze process capability.
  - Troubleshoot process and equipment issues to improve yield and throughput.
  
  3. Yield & Quality Improvement
  - Conduct root cause analysis of plating defects.
  - Work with quality and reliability teams to address substrate failure mechanisms.
  - Drive continuous improvement initiatives to enhance quality and cost efficiency.
  
  4. Cross-Functional Collaboration
  - Interface with design, manufacturing, equipment, and suppliers to meet production goals.
  - Support new product introductions (NPI) and qualification of plating processes.
  
  5. Documentation & Compliance
  - Maintain detailed documentation of plating recipes, process controls, and specs.
  - Ensure compliance with environmental, safety, and regulatory standards (e.g., RoHS, REACH).
  
  6. Ad-hoc duties
  - Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.