Simulation Engineering Expert (Chemical Mechanical Planarization)ID:37091

8,000 SGD ~ 10,000 SGDウエスト16日 前

概要

  • 給与

    8,000 SGD ~ 10,000 SGD

  • 業界

    Manufacturing(Electronics/Semiconductors)

  • 仕事内容

    Our client is seeking an experienced and highly skilled Simulation Engineer to join the Process R&D team. This role focuses on developing, implementing, and applying advanced computational models to simulate and optimise the Chemical Mechanical Planarization (CMP) process for dual damascene structures incorporating organic dielectrics and copper metallisation.

    The position bridges theoretical modelling and practical manufacturing challenges, supporting improvements in process yield, uniformity, and overall efficiency.

    Reports to: R&D Manager

    【 Responsibilities 】
    - Develop, implement, and validate predictive simulation models representing complex physical and chemical phenomena during CMP, including interactions between copper, organic dielectric materials, slurry chemistry, and pad mechanics.
    - Apply advanced simulation tools to analyze material removal rates (MRR), topography evolution, defect formation mechanisms, and sources of process non-uniformity.
    - Collaborate closely with process engineers and material scientists to integrate simulation outputs with experimental and production data, accelerating process learning and troubleshooting.
    - Optimize CMP process parameters (e.g. downforce/pressure, platen speed, slurry composition, pad conditioning) through simulation to meet planarization targets for dual damascene structures.
    - Analyze simulation results to identify and mitigate issues such as erosion, dishing, and interfacial delamination, providing actionable recommendations to improve yield and performance.
    - Design and execute simulation-based Design of Experiments (DoE) and communicate technical findings clearly to multidisciplinary teams and management through structured reports and presentations.
    - Keep abreast of developments in CMP technologies, organic dielectric materials, and computational modelling techniques relevant to advanced semiconductor manufacturing.

求めている人材

  • 応募条件

    【 Requirements & Preferences 】

    (Must)
    - Master’s or Ph.D. in Chemical Engineering, Materials Science, Mechanical Engineering, Physics, or a related discipline with a focus on computational modelling or semiconductor process engineering.
    - Approximately 10 years of relevant experience in process modelling or simulation within the semiconductor industry, preferably involving CMP or surface finishing processes.
    - Strong understanding of fluid dynamics, reaction kinetics, contact mechanics, and material science principles applicable to CMP.
    - Hands-on experience with commercial simulation software such as COMSOL Multiphysics and/or ANSYS Fluent / Mechanical.
    - Proficiency in programming or scripting languages (e.g. Python, MATLAB) for data analysis, model development, and customization.
    - Working knowledge of semiconductor fabrication processes, including dual damascene architectures, copper interconnects, and organic dielectric materials.

    (Advantageous)
    - Experience with specialized CMP modelling tools or proprietary simulation platforms.
    - Familiarity with statistical analysis software and methodologies (e.g. JMP, Minitab).
    - Experience working in high-performance computing (HPC) environments for large-scale simulations.

  • 英語

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  • その他言語

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