概述

• 薪资

  8,000 SGD ~ 14,000 SGD

• 产业类别

  Manufacturing(Electronics/Semiconductors)

• 工作内容

  Our client is launching a new business and establishing a new factory in Singapore. They are seeking a talented CMP Process Engineer to join their team and contribute to advanced substrate manufacturing.
  
  Reports to: R&D Manager
  
  【 Responsibilities 】
  
  1) Process Development & Optimization
  - Develop and refine CMP processes for planarizing dielectric and metal layers (e.g., copper, dielectric) in advanced substrate manufacturing.
  - Optimize polishing recipes, pad/slurry combinations, and process parameters to achieve planarity, low defectivity, and target thickness.
  
  2) Equipment & Tooling Support
  - Define equipment specifications and validate CMP tools.
  - Monitor and maintain CMP tool performance, including pad conditioning, slurry delivery systems, and endpoint detection technologies.
  
  3) Yield & Quality Improvement
  - Investigate and resolve CMP-related defects (e.g., dishing, erosion, scratching, delamination).
  - Implement process monitoring techniques such as thickness metrology (e.g., ellipsometry, profilometry) and defect inspection.
  
  4) Process Integration
  - Collaborate with upstream and downstream process owners (e.g., plating, lithography, etching) to ensure seamless integration.
  - Support the development of process flows for advanced packaging substrates, including SAP/Damascene and ABF/PI/PID-based technologies.
  
  5) Data Analysis & Documentation
  - Perform statistical analysis (e.g., DOE, SPC) to identify and control critical process parameters.
  - Document standard operating procedures (SOPs), work instructions, and control plans.
  
  6) Cross-Functional Collaboration
  - Work closely with design, product engineering, equipment vendors, and manufacturing teams to support process scale-up and new product introduction (NPI).
  - Assist with customer qualifications and reliability testing as needed.