概要

• 給与

  8,000 SGD ~ 14,000 SGD

• 業界

  Manufacturing(Electronics/Semiconductors)

• 仕事内容

  Our client is launching a new business and establishing a new factory in Singapore.
  They are seeking a talented Plating Process Engineer to join their team and contribute to advanced substrate manufacturing.
  
  Reports to: R&D Manager
  
  【 Responsibilities 】
  Process Development
  -Develop and optimize plating processes (e.g., electrolytic copper, Ni/Sn).
  -Evaluate new chemicals, materials, and equipment for plating process enhancement.
  -Establish plating parameters to ensure uniform thickness, adhesion, and reliability.
  
  Process Control & Monitoring
  -Monitor plating bath chemistry and maintain proper control limits.
  -Implement Statistical Process Control (SPC) and DOE to analyze process capability.
  -Troubleshoot process and equipment issues to improve yield and throughput.
  
  Yield & Quality Improvement
  -Conduct root cause analysis of plating defects.
  -Work with quality and reliability teams to address substrate failure mechanisms.
  -Drive continuous improvement initiatives to enhance quality and cost efficiency.
  
  Cross-Functional Collaboration
  -Interface with design, manufacturing, equipment, and suppliers to meet production goals.
  -Support new product introductions (NPI) and qualification of plating processes.
  
  Documentation & Compliance
  -Maintain detailed documentation of plating recipes, process controls, and specs.
  -Ensure compliance with environmental, safety, and regulatory standards (e.g., RoHS, REACH).
  
  Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.