概要

• 給与

  8,000 SGD ~ 14,000 SGD

• 業界

  Manufacturing(Electronics/Semiconductors)

• 仕事内容

  Our client is seeking an experienced and highly skilled Simulation Engineer to join our Process R&D team. This critical role involves developing, implementing, and utilizing advanced computational models to simulate and optimize the Chemical Mechanical Planarization (CMP) process for dual damascene structures incorporating organic dielectrics and copper metallization. The ideal candidate will bridge the gap between theoretical modelling and practical manufacturing challenges, enhancing process yield, uniformity, and efficiency.
  
  Reports to: R&D Manager
  
  【 Responsibilities 】
  - Develop and validate predictive simulation models representing complex physical and chemical phenomena during CMP, focusing on interactions between copper, organic dielectric materials, slurry chemistry, and pad mechanics.
  - Use advanced simulation software to analyse material removal rates (MRR), topography evolution, defect formation mechanisms, and process non-uniformity.
  - Collaborate with process engineers and material scientists to integrate simulation data with experimental results, accelerating process learning and troubleshooting.
  - Optimize process parameters (e.g., pressure, platen speed, slurry composition, pad conditioning) via simulation to achieve planarization targets for dual damascene structures.
  - Analyse simulation outputs to identify issues such as erosion, dishing, and delamination at material interfaces, providing actionable recommendations to improve performance and yield.
  - Design simulation experiments (DoE) and communicate technical findings clearly to multidisciplinary teams and management through detailed reports and presentations.
  - Stay updated on advancements in CMP technology, organic dielectric materials, and computational modelling to maintain a competitive edge in semiconductor manufacturing.