Wet Etch Process EngineerID:37094

8,000 SGD ~ 14,000 SGD西部约15小时 ago

概述

  • 薪资

    8,000 SGD ~ 14,000 SGD

  • 产业类别

    Manufacturing(Electronics/Semiconductors)

  • 工作内容

    Our client is launching a new business and establishing a new factory in Singapore. They are seeking an experienced Wet Etch Process Engineer to join their team and contribute to advanced packaging solutions.

    【 Responsibilities 】
    Process Development & Optimization
    -Develop and optimize wet etching processes for substrate layers.
    -Design experiments (DOE) to evaluate and improve critical etch parameters (e.g., etch rate, uniformity).
    -Establish and maintain robust process windows for R&D and volume production.

    Equipment & Materials Management
    -Define equipment requirements and manage tool qualifications (e.g., acid/ultrasonic cleaning, wet benches).
    -Monitor and maintain etching tool performance, chemistry concentration, and bath lifetime.
    -Evaluate and select etchants, and chemistry blends suitable for advanced substrates.

    Yield, Quality & Defect Control
    -Identify and resolve etching-related defects such as over-etch, or residues.
    -Analyze root causes of defects using SEM, optical inspection, and profilometry tools.
    -Collaborate with upstream/downstream processes to improve overall line yield and substrate performance.

    Cross-Functional Collaboration
    -Work closely with plating, lithography, CMP, and lamination teams to ensure seamless process integration.
    -Support new product introductions (NPI) and customer qualifications with process stability and repeatability.

    Documentation & Compliance
    -Create and maintain technical documentation such as process specifications, control plans, FMEAs, and work instructions.
    -Ensure processes comply with environmental, safety, and chemical handling regulations.

    Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.

资格

  • 应征条件

    【Requirements & Preferences】

    (Must)
    -PhD or Master’s degree in Chemical Engineering, Materials Science, Microelectronics, or related field.
    -5–10+ years of hands-on experience in substrate, PCB, or semiconductor etching processes.
    -Familiar with substrate materials such as ABF, PID, PI, or photoresists.
    -Knowledge of Damascene/SAP processes for high-density substrates.
    -Proficiency with process characterization tools (SEM, AFM, XPS, optical profilers).
    -Familiar with SPC, Six Sigma, and yield enhancement methodologies.

    (Advantageous)
    -Knowledge of substrate technologies such as Damascene, SAP, ABF build-up, or Embedding is a plus.

  • 英文

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  • 其他语言

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